1032(3X10)方头贴片保险丝

Description：

The SMD1032 High Current Fuse is a small square surface mount fuse that is designed to support higher current requirements of various applications.

Features：

• Surface mount high current fuse • Fully compatible with lead-free solder alloys and higher temperature profiles associated with lead-free assembly • RoHS compliant and Halogen Free • Available in ratings of 1 to 40 Amperes

Applications：

• High end servers / Blade computing• Base station power supply• Voltage regulator module• Cooling fan system for PC Server• Advance Telecommunication Computing Architecture (ATCA) applications for cloud computing• Battery Management System (Industrial Tools)

Material Details

NO.	Part Name	Material
1	End caps	Copper Plating/Silver
2	Body	Ceramic Tube
3	Fuse	Alloy wire
4	Explosion proof sand	quartz sand

Electrical Characteristics for Series

% of Ampere rating	OpeningTime
100%	4 hours, Minimum
200%	60 sec., Max.

Electrical Specifications by Item

Ampere Rating (A)	Amp Code	MaxVoltage Rating(V)	Interrupting Rating	Nominal Cold Resistance (Ohms)	Nominal Melting I2t (A2sec)	Agency Approvals
Ampere Rating (A)	Amp Code	MaxVoltage Rating(V)	Interrupting Rating	Nominal Cold Resistance (Ohms)	Nominal Melting I2t (A2sec)	UL	TUV
1.00	001.	125V/250V/300VAC 72V/125VDC	100A @125VAC 300A @ 65VAC 300A @ 100VDC 1000A @ 32VDC 500A @ 72VDC	0.2516	1.76	●	●
1.50	01.5			0.1186	4.70	●	●
2.00	002.			0.0708	6.76	●	●
2.50	02.5			0.0400	13.18	●	●
3.00	003.			0.0352	19.55	●	●
3.50	03.5			0.0261	32.70	●	●
4.00	004.			0.0227	40.80	●	●
5.00	005.			0.0171	59.59	●	●
6.00	006			0.0168	65.43	●	●
7.00	007			0.0153	68.57	●	●
8.00	008			0.0136	72.57	●	●
10.00	0001			0.0117	86.32	●	●
12.00	012			0.00254	116.45	●	●
15.00	015			0.00230	142	●	●
20.00	020			0.00191	435	●	●
30.00	030			0.00130	679	●	●
40.00	0.40			0.00089	900

Notes: - l2t calculated at 8ms. Resistance is measured at 10% of rated current, 23ºC

Temperature Derating Curve

Notes:

1. Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.

Example:For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)I_RAT= (0.68)I_RAT

Soldering Parameters

Reflow Condition	Pb – Free assembly
Pre Heat	- Temperature Min (Ts(min)) 150°C
	- Temperature Max (Ts(max)) 200°C
	- Time (Min to Max) (ts) 60 – 120 secs
Average ramp up rate (Liquidus Temp (TL) to peak	3°C/second max
TS(max) to TL - Ramp-up Rate	3°C/second max
Reflow	- Temperature (TL) (Liquidus) 217°C
Reflow	- Temperature (tL) 60 – 90 seconds
Peak Temperature (TP)	260+0/–5 °C
Time within 5°C of actual peak Temperature (tp)	20 – 40 seconds
Ramp-down Rate	5°C/second max.
Time 25°C to peak Temperature (TP)	8 minutes max.
Do not exceed	260°C
Wave Soldering Parameters	260°C Peak Temperature,3 seconds max.

Product Characteristics

Materials	Body: Ceramic Terminations: Gold-plated Caps
Product Marking	Brand, Amperage Rating
Operating Temperature	-55°C to 300V°C
Moisture Sensitivity Level	Level 1, J-STD-020C
Solderability	MIL-STD-202, Method 208
Insulation Resistance (after Opening)	MIL-STD-202, Method 302, Test ConditionA (10,000 ohms minimum)
Thermal Shock	MIL-STD-202, Method 107, Test Condition B, 5 cycles, -65°C to 300V°C, 15 minutes @ each extreme
Mechanical Shock	MIL-STD-202, Method 213, Test I:Deenergized. 100G’s pk amplitude, sawtooth wave 6ms duration, 3 cycles xYZ+xyz = 18 shocks
Vibration	MIL-STD-202, Method 201: 0.03" amplitude, 10-55 Hz in 1 min. 2hrs each xYZ=6hrs
Moisture Resistance	MIL-STD-202, Method 106, 10 cycles
Salt Spray	MIL-STD-202, Method 101, Test Condition B (48hrs)
Resistance to Soldering Heat	MIL-STD-202, Method 210, Test condition B (10 sec at 260°C)

Dimensions

Packaging

packaging Option	packaging Specification	Quantity	Quantity &packaging code
24 mm Tape and Reel	EIA RS-481-2	2000	ER

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